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Fig7 Magnetron Sputtering Vacuum Deposition System
发布者: 发布时间:2018-12-07
The Magnetron Sputtering system is used to deposit oxide and nitride films by the Plasma Vapor Deposition process. The deposited film is formed by chemical reaction between the target material and a gas which is introduced into the vacuum chamber. The composition of the film can be controlled by varying the relative pressures of the inert and reactive gases.